Key Features:
- Superior Wetting Properties: Ensures excellent adhesion and flow across various surfaces, allowing for consistent and uniform solder joints.
- High Metal Content: Contains a high percentage of finely powdered metal, providing strong, durable connections that enhance conductivity and reliability.
- Flux Activation: Formulated with an effective flux that cleans and prepares surfaces, removing oxides and contaminants to improve solder adhesion.
- Temperature Stability: Offers stable performance across a wide temperature range, suitable for various soldering applications, including surface-mount technology (SMT) and through-hole soldering.
- Low Residue: Leaves minimal residue after soldering, reducing the need for post-solder cleaning and minimizing the risk of corrosion or interference with electronic signals.
- Easy Application: Available in various packaging options such as syringes or jars for easy and precise application, whether using manual or automated dispensing equipment.
- RoHS Compliant: Meets Restriction of Hazardous Substances (RoHS) standards, ensuring it is safe for use in all types of electronic manufacturing and repair.
Applications:
- PCB Assembly: Used in the assembly of printed circuit boards (PCBs) to provide secure, conductive joints between components and the board.
- Surface Mount Technology (SMT): Essential for SMT applications where fine-pitch components require precise placement and reliable bonding.
- Repair and Rework: Ideal for reworking or repairing electronic circuits, allowing for easy and effective reattachment of components.
- Automated Soldering Processes: Suitable for use in automated soldering systems, ensuring consistent application and performance.
Why Choose This Soldering Paste?
Choose this high-quality soldering paste for its reliable performance, ease of use, and compliance with international standards. Its superior wetting properties, temperature stability, and low residue make it an ideal choice for all types of electronics assembly and repair applications.
Specifications:
- Metal Content: [Insert metal content percentage, e.g., 90% Sn (Tin), 10% Pb (Lead) or lead-free options]
- Flux Type: [Insert flux type, e.g., no-clean, water-soluble, rosin]
- Melting Point: [Insert melting point range, e.g., 183-218°C]
- Residue: Low residue formulation
- Viscosity: [Insert viscosity range]
- Packaging: Syringe, jar, or cartridge
- Compliance: RoHS Compliant
Usage and Care:
- Usage: Apply the paste to the desired area using a dispensing syringe, brush, or automated equipment. Ensure proper handling to avoid contamination and store in a cool, dry place to maintain consistency and quality.
- Care: Follow the manufacturer’s guidelines for storage and handling to preserve the paste’s performance. Avoid exposure to high temperatures and direct sunlight. Use within the specified shelf life for optimal results.
